Moulding and
Encapsulating
Features
Single mode
Multi mode
Simplex
Duplex
Breakout
Brand
MIKKELSEN ELECTRONICS
Fiber Optic Assembly
Mikkelsen Electronics A/S
T +45 4434 0300
www.mi-ec.com
info@mi-ec.com
Mounting in boxes
Assembly of spare part kits
Assembly projects of all kinds
Assembly
projects
Technomelt low pressure moulding
Thermoplastic high pressure moulding
2-component potting/casting
Ultrasound
Granulate
Machines
Melting units
Tools
Features
Over 30 years of experience
Combination of materials possible
Moulding electronics
PCB encapsulation
Strain relief
Thermoplastic hotmelt based on polyamide
Processing temp from 130
o
to 240
o
Ecological as produced from renewable raw
materials
Brands
HENKEL
MIKKELSEN ELECTRONICS
NORDSON
OPTIMEL
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